Specific Process Knowledge/Thermal Process/BCB Curing Oven

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BCB Curing Oven

The BCB Curing Oven. Positioned in the A-4 room

The BCB Curing Oven is mainly used for curing of BCB (bisbenzocyclobutene) and for alloying of metals in a nitrogen atmosphere.

During processing the furnace is rapidly heated by use of eight halogen lamps situated below the sample. The furnace is purged with a nitrogen flow (high or low flow). Samples are processed at atmospheric pressure or at vacuum.

The user manual, user APV, technical information and contact information can be found in LabManager:

BCB Curing Oven

Process information

Here are some of the standard processes used in the BCB Curing Oven.

BCB curing:

• Long curing at 210°C: BCB210AL.PDF/BCB210BL.PDF
• Long curing at 250°C: BCB250AL.PDF/BCB250BL.PDF

Content of BCB250BL.PDF: (the file BCB210BL.PDF is identical except that the max temperature is 210 instead of 250°C)

;
; stored 31.08.2011  at 17:55:33
{P0}
00,00:30,0020,- - - - 3 - - - -,075,250,001,005,028
01,00:10,0020,- - - 2 - - - - -
02,00:30,0020,- - - - 3 - - - -
03,00:10,0020,- - - 2 - - - - -
04,05:00,0050,H - - 2 - - - - -
05,05:00,0050,H C - 2 - - - - -
06,15:00,0100,H - 1 - - - - - -
07,45:00,0100,H C 1 - - - - - -
08,15:00,0150,H - 1 - - - - - -
09,81:00,0150,H C 1 - - - - - -
10,60:00,0250,H - 1 - - - - - -
11,60:00,0250,H C 1 - - - - - -
12,15:00,0020,- C 1 - - - - - -
13,30:00,0020,- C 1 - - - - - -
14,00:00,0010,- C - - - - - - -

The AL/BL processes are (should be) identical except for a (2x) pump/purge cycle in the beginning of the BL processes.

General processes

There are a number of general processes named DxxxCyyy.PDF.

The Dxxx is the set temperature (in °C) and the Cyyy is the time (in minutes) at the set temperature.

The oven heats to the set temperature (xxx) in 5 mins and then stays at the temperature (xxx) for a time (yyy) after which it cools to room temperature as fast as possible.

The program sequence looks like this for the file D200C060.PDF:

;
; stored 31.08.2011  at 18:15:47
{P0}
00,05:00,0200,H - - 2 - - - - -,075,250,001,005,028
01,60:00,0200,H C 1 - - - - - -
02,05:00,0002,- C 1 - - - - - -
03,00:00,0000,- C - - - - - - -

Equipment performance and process related parameters

Equipment		BCB Curing Oven
Purpose		BCB curing Metal alloying
Process parameter range	Temperature	22 - 450oC
	Nitrogen flows	Low N2 flow: 5 SLM High N2 flow: Max 16.7 SLM
	Pressure	Atmospheric pressure or vacuum
Substrates (Remember to use the right carrier wafer)	Batch size	Several small samples One 50 mm wafer One 100 mm wafer
	Allowed materials	BCB III-V materials Co-polymer Silicon, silicon oxide, silicon nitride Quartz Resist (prebaked) Metal (only Al, Ni, Ge and Au)