Specific Process Knowledge/Thermal Process

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Boron Drive-in + Predep furnace (A1) - For oxidation and annealing of Si wafers, and for boron pre-deposition (doping) and for drive-in afterwards
Gate Oxide furnace (A2) - For gate oxide growing on new wafers
Phosphorus Drive-in furnace (A3) - For oxidation and annealing of Si wafers and for drive-in after phosphorus pre-dep
Phosphorus Predep furnace (A4) - For pre-deposition (doping) of phosphorus on Si wafers
Anneal-oxide furnace(C1) - For oxidation and annealing of 100 mm and 150 mm wafers
III-V oxidation furnace(C2) - For oxidation of Al_xGaAs layers.
Anneal-bond furnace (C3) - For oxidation and annealing of bonded wafers
Aluminium Anneal furnace (C4) - For annealing of wafers containing aluminium, Al₂O₃ and TiO₂
Noble furnace - For annealing and oxidation of non-clean wafers
APOX furnace - For growing of very thick oxide layers - (Decommissioned)
Jipelec RTP - For rapid thermal annealing of III-V materials and Si based materials
BCB Curing oven - For resist curing and metal alloying
Furnace: Multipurpose annealing - For annealing, oxidation and resist pyrolysis
Resist Pyrolysis furnace - For pyrolysis of different resist layers
III-V Oven (D4) - For oxidation of Al_xGaAs layers. - (Decommissioned)