Specific Process Knowledge/Thin film deposition/thermalevaporator
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Thermal evaporator- A system for deposition of metals
The main purpose of the thermal evaporator is to deposit Al for removing charging of the resist when doing EBL on isolating substrate.
It is not only usable for Al deposition. The thermal evaporator has room for two boats and thereby the possibility to make thin films of two different metals. At the moment not that many metals have been tested and made a recipe for. Right only Al and Ag can be evaporated. We have also attempted to evaporate Zn but this was not so easy, so it is not a standard process. If you would like to deposit other metals, please talk to the Thin Film group.
The user manual, APV, technical information and contact information can be found in LabManager:
Thermal Evaporator in LabManager
Process information
Materials for thermal evaporator evaporation
Purpose | Deposition of metals |
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---|---|---|
Performance | Film thickness |
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Deposition rate |
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Process parameter range | Process Temperature |
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Process pressure |
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Substrates | Batch size |
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Substrate material allowed |
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Material allowed on the substrate |
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* For thicknesses above 300 nm, please request permission.