Specific Process Knowledge/Characterization/Probe station

From LabAdviser

Probe station

Probe station. Positioned in serviceroom CX1

The purpose is to measure the thickness of wafers, depths of larger grooves or height of larger mesas.

During a KOH etch it can be helpful to ensure no over-etching by making a thickness measurement during the etching.

Equipment performance and process related parameters

Purpose

Thickness measurer

  • Wafer thickness
  • Depths of larger grooves
  • Heigth of larger mesas

Performance

Thickness resolution

  • < 5 µm

Substrates

Batch size

  • One sample
Substrate materials allowed
  • No restrictions


The Probe station is a - EPS150Triax - Cascade for I/V measurement, ohmic measurements etc, it has 4 individually adjustable probes, but can be fitted with more. It has several source meters, multi meters and a computer attached.

It can be used from pieces up to 6" wafers

File:Probestation.jpg
Probe station: positioned in Service room CX1

The user manual, technical information and contact information can be found in LabManager:

Probe station

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