Specific Process Knowledge/Thermal Process/BCB Curing Oven
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BCB Curing Oven
The BCB Curing Oven is mainly used for curing of BCB (bisbenzocyclobutene) and for alloying of metals in a nitrogen atmosphere.
During processing the furnace is rapidly heated by use of eight halogen lamps situated below the sample. The furnace is purged with a high or a low nitrogen flow. Samples are processed at atmospheric pressure or at vacuum.
The user manual, user APV, technical information and contact information can be found in LabManager:
Process information
Here are some of the standard processes used in the BCB Curing Oven.
BCB curing:
- Long curing at 210°C: BCB210AL.PDF/File:BCB210BL.PDF
- Long curing at 250°C: BCB250AL.PDF/File:BCB250BL.PDF
Content of BCB250BL.PDF: (the file BCB210BL.PDF is identical except that the max temperature is 210 instead of 250°C)
; ; stored 31.08.2011 at 17:55:33 {P0} 00,00:30,0020,- - - - 3 - - - -,075,250,001,005,028 01,00:10,0020,- - - 2 - - - - - 02,00:30,0020,- - - - 3 - - - - 03,00:10,0020,- - - 2 - - - - - 04,05:00,0050,H - - 2 - - - - - 05,05:00,0050,H C - 2 - - - - - 06,15:00,0100,H - 1 - - - - - - 07,45:00,0100,H C 1 - - - - - - 08,15:00,0150,H - 1 - - - - - - 09,81:00,0150,H C 1 - - - - - - 10,60:00,0250,H - 1 - - - - - - 11,60:00,0250,H C 1 - - - - - - 12,15:00,0020,- C 1 - - - - - - 13,30:00,0020,- C 1 - - - - - - 14,00:00,0010,- C - - - - - - -
The AL/BL processes are (should be) identical except for a (2x) pump/purge cycle in the beginning of the BL processes.
General processes
There are a number of general processes named DxxxCyyy.PDF.
The Dxxx is the set temperature (in °C) and the Cyyy is the time (in minutes) at the set temperature.
The oven heats to the set temperature (xxx) in 5 mins and then stays at the temperature (xxx) for a time (yyy) after which it cools to room temperature as fast as possible.
The program sequence looks like this for the file D200C060.PDF:
; ; stored 31.08.2011 at 18:15:47 {P0} 00,05:00,0200,H - - 2 - - - - -,075,250,001,005,028 01,60:00,0200,H C 1 - - - - - - 02,05:00,0002,- C 1 - - - - - - 03,00:00,0000,- C - - - - - - -
Equipment | BCB Curing Oven | |
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Purpose |
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Process parameter range | Temperature |
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Nitrogen flows |
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Pressure |
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Substrates
(Remember to use the right carrier wafer) |
Batch size |
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Allowed materials |
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