Specific Process Knowledge/Etch/DRIE-Pegasus/showerheadchange/polySi/Cduv

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Process runs
Date Substrate Information Process Information SEM Images
Wafer info Mask Material/ Exposed area Tool / Operator Conditioning Recipe Wafer ID Comments
4/9-2014 1/4 6" ELK stitching CB on oxide carrier standard stepper mask (50 nm barc + 320 nm krf) Si / 50+ % on die Pegasus/jmli 5 minute TDESC clean + 30 sec barc etch jml/polySi/lshbaseline-A: 50 cycles or 6:15 minutes S004301

File:Peg-S004301-03.jpg File:Peg-S004301-04.jpg File:Peg-S004301-05.jpg File:Peg-S004301-06.jpg File:Peg-S004301-01.jpg File:Peg-S004301-02.jpg

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