Specific Process Knowledge/Etch/DRIE-Pegasus
The DRIE Pegasus at Danchip
The Bosch process
The DRIE Pegasus is a state-of-art silicon dry etcher that offers outstanding performance in terms of etch rate, uniformity etc. It uses the so-called Bosch process to achieve excellent control of the etched features. Click here for more fundamental information of the system.
User manuals etc.
The user manual, quality control procedure and the results may all be found on the DRIE-Pegasus LabManager page.
Important information
In August 2011 we introduced a new set of rules regarding the loading of wafers. In you were trained prior to this, you can find more information here.
Acceptance test
The instrument was opened for users in April 2010 when the acceptance test was signed. This was based on the performance of five standard recipes (A, B, C, D and SOI) that are further examined below. The acceptance test report is found here.
Process information
Process notation
Describing a process recipe on the Pegasus may sometimes be difficult because of the great flexibility of the instrument. A compact and precise notation is therefore required for the recipes. Click here to find a short description of the official SPTS notation.
The SOI etch uses the Low frequency (LF) platen generator to minimize the notching at buried stop layers such as the BOX layer in a SOI wafer.
SOI etch: Recipe, specifications and results
Other processes
Nanoetching
Wafer thinning
Sloped sidewalls
For injection molding purposes
Processing challenges
Bonded wafers
User manuals
- The Danchip user manual from LabManager is found >Here<.
- The user manual provided by SPTS can be found here >HERE<
Hardware information
Hardware Information - Overview.
Hardware Information - Detailed.
The Advantages the Pegasus has over existing Si etchers.
Robot Handling System Information .
Process applications
Further info: