Specific Process Knowledge/Etch/DRIE-Pegasus/Pegasus-4

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Pegasus 4 - 150mm silicon oxide and silicon nitride etching

The DRIE-Pegasus3 and DRIE-Pegasus4 operator station and cassette loading stations, Photo: DTU Nanolab internal

The user manual(s), quality control procedure(s) and results, user APV(s) are not available, technical information and contact information can be found in LabManager:

Equipment info in LabManager

Process information

Standard recipes

• Barc Etch
• SiO2 Etch
• Slow etch of silicon nitride and silicon oxide

Hardware changes

A few hardware modifications have been made on the Pegasus 3/4 since it was installed in 2019. The changes are listed below.

• Change of showerhead in 2019

Wafer bonding

To find information on how to bond wafers or chips to a carrier wafer, click here.