Front Image
|
-
|
|
|
|
Make a mask on your sample
|
|
|
Clean your sample
|
Entry page in LabAdviser
|
Techniques
|
Materials
|
Wafer cleaning
|
Soap Sonic
|
Removes dust and particles
|
7-up & Piranha
|
Removes traces of organics and alkali ions
|
RCA
|
Two step process to remove traces of organics and metals
|
5% HF
|
Removes native oxide
|
IMEC
|
Removing dust, traces of organics and alkali ions and slightly polish the surface.
Make the surface hydrophillic
|
Dry your sample
|
Entry page in LabAdviser
|
Techniques
|
Materials
|
Wafer and sample drying
|
Spin dryers
|
Whole wafers
|
Critial point dryer
|
Sensitive wafers
|
Ethanol fume drying
|
Sensitive wafers
|
N2 blow drying
|
N2 pistols
|
Thermal treatment of your sample
|
Entry page in LabAdviser
|
Techniques
|
Materials
|
Thermal Process
|
Annealing (>350C)
|
Si, PECVD layers, Al, BCB curing, Polymer
|
Oxidation
|
Si wafers
|
Doping with B/P
|
Si wafers
|
Pyrolysis
|
Resists: AZ, SU8, PDMS
|
Rapid Thermal Anneal (RTP)
|
SiO2, Si3N4, Ti, III-V
|
Lithography/Baking
|
Baking (<300dg)
|
baking resist and polymers
|
Make a mask on your sample
|
Entry page in LabAdviser
|
Techniques
|
Materials
|
Lithography
|
Pattern design & Mask fabrication
|
|
Photolithography
|
UV resists
|
Deep UV lithography
|
DUV resists
|
E-beam lithography
|
E-beam resists
|
Imprinting
|
Polymers
|
|