Specific Process Knowledge/Etch/DRIE-Pegasus/Pegasus-2

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This system is a research tool and not available to the users

If you want to get access to the tool, then talk to professor Henry Jansen

• Nanoscale silicon etching with SF6 and O2
• Black silicon on Demand

Current setup and rules on Pegasus 2

Click here to access older configurations.

The current configuration is

Access to Pegasus 2 configuration templates

Pegasus 2 configuration table version 1

• Table header: Template:Peg2configheader1
• Table content: Template:Peg2configcontent1

Currently valid from November 2020 onwards

Item	The currently applied modification	Comments
Available gasses and gas chemistry	* SF6: 50 sccm O2: 50 sccm Ar: 283 sccm N2: 500 sccm He: 11 sccm CO2: (It is not in the software)	OnlySF6 and O2 are used for Si, PR, and Cr etch. The rest is only make-up