Specific Process Knowledge/Thin film deposition

From LabAdviser
Revision as of 11:12, 29 July 2020 by Reet (talk | contribs) (→‎Choose material to deposit: made a new page on sputtering of oxides and other compounds)
3rd Level - Material/Method

Feedback to this page: click here


Choose material to deposit

Semiconductors Oxides Nitrides Metals Alloys Transparent conductive oxides Polymers

Silicon
Germanium

Aluminium Oxide (Al2O3)
Barium titanate (BaTiO3)
Chromium Oxide (Cr2O3)
Hafnium Oxide (HfO2)
Silicon Oxide (SiO2)
Titanium Oxide (TiO2)
Tantalum Oxide (Ta2O5)
Zinc Oxide (ZnO)


Silicon Nitride - and oxynitride
Titanium Nitride - conductive ceramics
Aluminum Nitride (AlxNy)


Aluminium
Chromium
Cobalt
Copper
Gold
Iron
Magnesium
Molybdenum
Nickel
Niobium
Palladium
Platinum
Ruthenium
Silver
Tantalum
Tin
Titanium
Tungsten
Zinc


AlCu
CoFe
CuTi
FeMn
MnIr
NbTi
NiCo
NiFe
NiV alloy
TiW alloy (10%/90% by weight)

And an electroceramic:

YSZ (Yttrium stabilized zirconia)

ITO (Tin doped Indium Oxide)
AZO (Aluminum doped Zinc Oxide)

SU-8
Antistiction coating
Topas
PMMA

Choose deposition equipment

PVD LPCVD PECVD ALD Coaters Others



  • ALD1 - Atomic Layer Deposition (thermal)
  • ALD2 (PEALD) - Atomic Layer Deposition (thermal and plasma enhanced)

See the Lithography/Coaters page for coating polymers