Specific Process Knowledge/Thin film deposition

From LabAdviser
3rd Level - Material/Method

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Choose material to deposit

Dielectrica Semicondutors Metals Nitrides Alloys Transparent conductive oxides Polymers

Silicon Oxide (SiO2)
Titanium Oxide (TiO2)
Aluminium Oxide (Al2O3)
Tantalum Oxide (Ta2O5)
Chromium Oxide (Cr2O3)
Hafnium Oxide (HfO2)

Silicon
Germanium
Zinc Oxide (ZnO)

Aluminium
Chromium
Cobalt
Copper
Gold
Iron
Magnesium
Molybdenum
Nickel
Niobium
Palladium
Platinum
Ruthenium
Silver
Tantalum
Tin
Titanium
Tungsten
Zinc


Silicon Nitride - and oxynitride
Titanium Nitride - conductive ceramics
Aluminum Nitride (AlxNy)


TiW alloy (10%/90% by weight)
NiV alloy
AlCu
CoFe
CuTi
FeMn
MnIr
NiCo
NiFe
YSZ (Yttrium stabilized Zirconium)

ITO (Tin doped Indium Oxide)
AZO (Aluminum doped Zinc Oxide)

SU-8
Antistiction coating
Topas
PMMA

Choose deposition equipment

PVD LPCVD PECVD ALD Coaters Others



  • ALD1 - Atomic Layer Deposition (thermal)
  • ALD2 (PEALD) - Atomic Layer Deposition (thermal and plasma enhanced)

See the Lithography/Coaters page for coating polymers