Specific Process Knowledge/Thin film deposition/thermalevaporator

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Alcatel - A system for deposition of metals

positioned in cleanroom A-1.

The user manual, APV, technical information and contact information can be found in LabManager:

Thermal Evaporator in LabManager


Process information

Materials for thermal evaporator evaporation


Equipment performance and process related parameters Alcatel

Purpose Deposition of metals and silicon
  • Thermal evaporation of metals
Performance Film thickness
  • 10Å - 1µm* (for some materials)
Deposition rate
  • 0.5 Å/s - 5 Å/s (material dependens)
Process parameter range Process Temperature
  • Approximately room temperature
Process pressure
  • Low than 4*10-6 mbar
Substrates Batch size
  • Up to 8" wafer
  • Or several smaller pieces
  • Deposition on one side of the substrate
Substrate material allowed
  • Silicon wafers
  • Quartz wafers
  • Pyrex wafers
Material allowed on the substrate
  • Silicon oxide
  • Silicon (oxy)nitride
  • Photoresist
  • PMMA
  • Mylar
  • Metals

* For thicknesses above 200 nm permission is requested.