Specific Process Knowledge/Etch/Wet Titanium Etch
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Ething of Titanium can be done either wet or dry. For wet etching please see below on this page. Dry etching can be done either with ICP using Chlorine chemistry or with IBE by sputtering with Ar ions.
Wet etching of Titanium
Wet etching of titanium can be done in the "HF5%/BHF-dirty" bath in this fume hood
Wet etching of titanium can also be done in beakers with BHF or RCA1 mix in a beaker in one of these fume hoods
We have two solutions for wet titanium etching:
- BHF (wetbench or fumehood)
- Cold RCA1 (fumehood)
BHF etching can take place in the 'HF5%/BHF-dirty' bath inside Fumehood(RCA) in cleanroom B-1. This is the only ready made BHF bath where metals are allowed. You can also do the titanium etch in BHF or RCA1 mix by making your own solution in a beaker in Fumehood 01 or 02 in cleanroom D-3. You can see the APV here.
Comparing the two solutions
| BHF | Cold RCA1 | |
|---|---|---|
| General description | Etch of titanium with or without photoresist mask. | Etch of titanium (as stripper or with eagle resist). |
| Link to safety APV and KBA | see APV here | see APV here |
| Chemical solution | HF:NH4F | NH3OH:H2O2:H2O - 1:1:5 |
| Process temperature | Room temperature | Room temperature |
| Possible masking materials |
Photoresist (1.5 µm AZ5214E) |
Eagle resist |
| Etch rate |
Not known (it bubbles while etching) |
Not known |
| Batch size |
1-5 4" in beaker 1-25 wafers at a time in PP-etch bath |
1-5 4" wafer at a time |
| Size of substrate | Any size and number that can go inside the beaker in use. | Any size and number that can go inside the beaker in use. |
| Allowed materials |
No restrictions when used in beaker or PP-etch bath in the fume hood in cleanroom 2. Make a note on the beaker of which materials have been processed. |
No restrictions when used in beaker. Make a note on the beaker of which materials have been processed. |