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Deposition of aluminium oxide
Aluminium oxide (Alumina, Al2O3 ) can be deposited by use of ALD (atomic layer deposition) or by a sputter technique in the Lesker Sputter System or the Cryofox PVD co-sputter/evaporation. During the sputter deposition oxygen is added to the chamber resulting in aluminium oxide on the sample
Comparison of the methods for deposition of Titanium Oxide
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Sputter technique using IBE/IBSD Ionfab300
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Sputter System Lesker
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III-V Dielectric evaporator
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ALD Picosun 200
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Generel description
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- TiO2 created from a Ti sputter target. By adding oxygen during the deposition TiO2 is created.
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- Reactive DC sputtering of Ti target in Ar/O2 (10% O2) plasma.
- RF sputtering of TiO2 target
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- E-beam evaporation of TiO2
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- ALD (atomic layer deposition) of TiO2
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Stoichiometry
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- Can probably be varied (sputter target: Ti, O2 added during deposition)
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- Temperature dependent - Anatase or amorphous TiO2
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Film Thickness
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Deposition rate
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- 3.0-3.5nm/min (reactive DC sputtering)
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- 3 - 5 nm/min (RF sputtering)
- 0.3 - 0.5nm/min
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Step coverage
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- Very good. Covers sample everywhere (but long purge time needed for very high aspect ratio structures)
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Process Temperature
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- Expected to be below 100oC
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- Done at RT. There is a possibility to run at higher temperatures
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- Sample temperature can be set to 20-250 oC
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- 120oC - 150oC: Amorphous TiO2
- 300oC - 350oC: Anatase TiO2
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More info on TiO2
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Substrate size
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- 1 50mm wafer
- 1 100mm wafer
- 1 150mm wafer
- 1 200mm wafer
- Smaller pieces can be mounted with capton tape
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- several small samples
- several 50 mm wafers (Ø150mm carrier)
- 1x 100 mm wafers
- 1x 150 mm wafers
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- 1x 2" wafer or
- several smaller samples
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- 1-5 100 mm wafers
- 1-5 150 mm wafers
- Several smaller samples
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Allowed materials
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- Almost any materials
- not Pb and very poisonous materials
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- Almost any materials
- Pb and poisonous materials only after special agreement
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- Silicon
- Silicon oxide, silicon nitride
- Quartz/fused silica
- Al, Al2O3
- Ti, TiO2
- Other metals (use dedicated carrier wafer)
- III-V materials (use dedicated carrier wafer)
- Polymers (depending on the melting point/deposition temperature, use carrier wafer)
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