Specific Process Knowledge
Feedback to this page: click here
Choose the process topic you are interested in
The section below here is under construction
Overview of sample processing
Clean the sample |
---|
Drying Samples |
---|
Thermal treatment of the sample |
---|
Make a mask on the sample |
---|
Lithography |
Imprinting |
Transfer pattern into the sample |
---|
Wet etch |
Dry etch |
Lift-off |
Direct structure definition |
---|
Imprinting |
LASER machining |
Lithographic definition |
Polymer Injection molding |
Bonding samples together |
---|
Characterize the sample |
---|
Back end of the sample |
---|
Chip/die mounting |
Wire bonding |
Dicing |
Overview of sample processing 2
|
|
|
| ||||||||||||||||||||||||||||||
|
|
|
| ||||||||||||||||||||||||||||||
|
|
Overview of sample processing 3
Clean your sample |
---|
Drying your Samples |
---|
Create a layer/film on your sample | |
---|---|
Thermal Oxide growth | |
Physical Vapour Deposition | |
Sputter deposition | |
Thermal deposition | |
E-beam evaporation | |
CVD | |
LPCVD | |
PECVD | |
Coating | |
Spin coating | |
Spray coating | |
Electroplating | |
Epitaxial growth |
Thermal treatment of your sample |
---|
Make a mask on your sample |
---|
Lithography |
Imprinting |
Transfer mask pattern to your sample |
---|
Wet etch |
Dry etch |
Lift-off |
Direct structure definition on your sample |
---|
Imprinting |
LASER machining |
Lithographic definition |
Polymer Injection molding |
Bonding your samples together |
---|
Characterize your sample |
---|
Back end processing of your sample |
---|
Chip/die mounting |
Wire bonding |
Dicing |