Specific Process Knowledge/Lithography/LiftOff
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Lift-off process
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Comparing Lift-off equipment
| Equipment | Lift-off Wet Bench | Lift-off (4", 6") | |
|---|---|---|---|
| Purpose |
|
| |
| Bath chemical |
Acetone |
NMP (Remover 1165) | |
| Process parameters | Process temperature |
Room temperature |
Heating of the bath is possible. The heating has been limited to 37°C |
| Ultrasonic agitation |
Continuous (on/off) |
Continuous or pulsed The power may be varied | |
| Substrates | Substrate size |
|
|
| Allowed materials |
Silicon or glass wafers Film or patterning of all but Type IV (Pb, Te) |
Silicon or glass wafers Film or patterning of all but Type IV (Pb, Te) | |
| Batch |
1 - 25 |
1 - 8 | |
Lift-off Wet Bench
This bench is only for wafers with metal!
The user manual, and contact information can be found in LabManager
Process information
Process recommandations for Lift-off wet bench:
- Place the wafers in a dedicated wafer holder.
- Put the holder in the acetone and start the ultrasound. The strip off time is depending of resist thickness.
- Rinse your wafers for 4-5 min. in running water after stripping.
For more information on image reversal of AZ 5214E, see here: Specific Process Knowledge/Photolithography/AZ5214E standard resist - reverse process
Lift-off (4", 6")
The user manual, and contact information can be found in LabManager
Process information
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