Specific Process Knowledge/Lithography/UVLithography
UV Lithography uses ultraviolet light to transfer a pattern from a mask to a wafer coated with photoresist. The photoresist film is spin coated on the wafers and the pattern is transferred to the wafer by using a mask aligner. DTU Danchip houses a number of automatic or semi-automatic coaters and mask aligners.
Resist | Comments | Pre-treatment | Resist Coating | Exposure | Baking | Developing | Stripping, Lift-off |
---|---|---|---|---|---|---|---|
AA | AA | AA | AA | AA | AA | AA | AA |
BB | BB | BB | BB | BB | BB | BB | BB |
CC | CC | CC | CC | CC | CC | CC | CC |
Resist Overview
Resist | Polarity | Manufacturer | Comments | Technical reports | Spin Coating | Development | Rinse | Remover | Process flows (in docx-format) |
AZ5214E | Positive | AZ5214E.pdf | SSE, KS Spinner, III-V Spinner |
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AZ4562 | Positive | AZ4500.pdf | SSE, KS Spinner | ||||||
AZ MiR 701 | Positive | AZ_MiR_701.pdf | Spin Track 1 + 2 | Process_Flow_AZ_MiR701.docx | |||||
AZ nLOF 2020 | Negative | AZ_nLOF_2020.pdf | Spin Track 1 + 2 | Process_Flow_AZ_nLOF_2020.docx
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SU8 | Positive | KS Spinner |
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