Specific Process Knowledge/Back-end processing/Polishing machine: Difference between revisions
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'''Feedback to this page''': '''[mailto:danchipsupport@danchip.dtu.dk?Subject=Feed%20back%20from%20page%20http://http://labadviser.danchip.dtu.dk/index.php?title=Specific_Process_Knowledge/Back-end_processing/Die_Bonder click here]''' | |||
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/ | == Polisher/Lapper == | ||
The Logitech PM5 Polisher/Lapper is for thinning down wafers and other substrates. | |||
'''The user manual(s), quality control procedure(s) and results, user APV(s), technical information and contact information can be found in LabManager:''' | |||
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[[image:Logitech_PM5.jpg|200x200px|right|thumb|The Logitech PM5 Polisher/Lapper]] | |||
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[http://labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=306 The Logitech PM5 Polisher/Lapper in LabManager] | |||
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Revision as of 16:06, 6 May 2013
Feedback to this page: click here
Polisher/Lapper
The Logitech PM5 Polisher/Lapper is for thinning down wafers and other substrates.
The user manual(s), quality control procedure(s) and results, user APV(s), technical information and contact information can be found in LabManager:
The Logitech PM5 Polisher/Lapper in LabManager