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Specific Process Knowledge/Thermal Process/Dope with Phosphorus: Difference between revisions

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====Test measurement====
====Test measurement====
'''
'''
There was made several measurement on the different wafer in the process. After the predep was the oxide thickness, sheet resistance and slice resistivity measured on some of the wafer.
{| border="2" cellpadding="2" cellspacing="1" style="text-align:center;"
|+ '''Measurement after Predep'''
|-
!
! colspan="2" | Elipsometer
! colspan="2" | Four Point Probe
|-
! width="120" | Wafer # 
! width="120" | Thinkness [nm]
! width="120" | Refrative index
! width="120" | Sheet
! width="120" | Slice
|-
! 3
| 27,4
| 1,4623
| 311
| 17,32
|-
! 7
| 45,27
| 1,4622
| 138,5
| 7,61
|-
! 11
| 61,36
| 1,4625
| 16,12
| 0,859
|-
! 15
| 80,45
| 1,4624
| 7,4
| 0,392
|-
! 19
| 119,37
| 1,4623
| 6,6
| 0,246
|-
|}