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Specific Process Knowledge/Etch/DRIE-Pegasus/processA: Difference between revisions

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Bureaucrats, danchip, Administrators
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Bureaucrats, danchip, Administrators
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Line 184: Line 184:
image:C01548.04-A.jpg|Wafer C01548.01: 35 % exposed area
image:C01548.04-A.jpg|Wafer C01548.01: 35 % exposed area
image:C01548.05-A.jpg|Wafer C01548.01: 50 % exposed area
image:C01548.05-A.jpg|Wafer C01548.01: 50 % exposed area
Without pre-etch measurements of the thicknesses of the photoresist it is not possible to determine the resist etch rate. However, it looks very uniform.
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