Specific Process Knowledge/Thin film deposition/Deposition of Silicon Oxide: Difference between revisions
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==Deposition of Silicon Oxide using sputter deposition technique== | ==Deposition of Silicon Oxide using sputter deposition technique== | ||
At DANCHIP you can also deposit silicon oxide using [[Specific Process Knowledge/Thin film deposition/Lesker|Lesker]], [[Specific Process Knowledge/Thin film deposition/Multisource PVD|PVD co-sputter/evaporation]] or IBE Ionfab300 | At DANCHIP you can also deposit silicon oxide using [[Specific Process Knowledge/Thin film deposition/Lesker|Lesker]], [[Specific Process Knowledge/Thin film deposition/Multisource PVD|PVD co-sputter/evaporation]] or [[Specific Process Knowledge/Etch/IBE⁄IBSD Ionfab 300|IBE Ionfab300]] | ||
sputter systems. One of the advantages here is that you can deposit on any material you like. | sputter systems. One of the advantages here is that you can deposit on any material you like. | ||
*[[Specific Process Knowledge/Thin film deposition/Deposition of Silicon oxide in PVD co-sputter/evaporation|Deposition of Silicon Oxide using PVD co-sputter/evaporation tool]] | *[[Specific Process Knowledge/Thin film deposition/Deposition of Silicon oxide in PVD co-sputter/evaporation|Deposition of Silicon Oxide using PVD co-sputter/evaporation tool]] | ||