Specific Process Knowledge/Thin film deposition/Furnace LPCVD TEOS: Difference between revisions
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The LPCVD TEOS has a excellent step coverage and is very good for trench filling. The film thickness is very uniform over the wafer. | The LPCVD TEOS has a excellent step coverage and is very good for trench filling. The film thickness is very uniform over the wafer. | ||
'''The user manual(s), quality control procedure(s) and results, technical information and contact information can be found in LabManager:''' | |||
'''[http://www.labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=85 Bor Drive-in]''' | |||
==Process Knowledge== | ==Process Knowledge== | ||