Specific Process Knowledge/Etch/DRIE-Pegasus: Difference between revisions
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*[[Specific Process Knowledge/Etch/DRIE-Pegasus/Waferthinning| Maskless reduction of wafer thicknesses]] | *[[Specific Process Knowledge/Etch/DRIE-Pegasus/Waferthinning| Maskless reduction of wafer thicknesses]] | ||
== | '''Material from SPTS''' | ||
*[[Specific Process Knowledge/Etch/DRIE-Pegasus/SPTSdocs|Hardware and process applications]] | |||
== SPTS documents on information == | |||
[[Media:Pegasus_sheet_V8.pdf |Hardware Information - Overview]]. | [[Media:Pegasus_sheet_V8.pdf |Hardware Information - Overview]]. | ||