Specific Process Knowledge/Etch/DRIE-Pegasus: Difference between revisions
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Describing a process recipe on the Pegasus may sometimes be difficult because of the great flexibility of the instrument. A compact and precise notation is therefore required for the recipes. Click [[Specific_Process_Knowledge/Etch/DRIE-Pegasus/Notation|here]] to find a short description of the official SPTS notation. | Describing a process recipe on the Pegasus may sometimes be difficult because of the great flexibility of the instrument. A compact and precise notation is therefore required for the recipes. Click [[Specific_Process_Knowledge/Etch/DRIE-Pegasus/Notation|here]] to find a short description of the official SPTS notation. | ||
'''Standard recipes''' | '''[[Specific Process Knowledge/Etch/DRIE-Pegasus/StandardRecipes|Standard recipes]]''' | ||
*[[Specific Process Knowledge/Etch/DRIE-Pegasus/processA|Process A (Large trench): 80 µm wide trench etched down to a depth of 150 µm]] | *[[Specific Process Knowledge/Etch/DRIE-Pegasus/processA|Process A (Large trench): 80 µm wide trench etched down to a depth of 150 µm]] | ||
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*[[Specific Process Knowledge/Etch/DRIE-Pegasus/processD|Process D (Micro stamp): ]] | *[[Specific Process Knowledge/Etch/DRIE-Pegasus/processD|Process D (Micro stamp): ]] | ||
== The standard processes: Processes A, B, C, D and SOI == | == The standard processes: Processes A, B, C, D and SOI == | ||