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Specific Process Knowledge/Thin film deposition/Furnace LPCVD TEOS: Difference between revisions

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|style="background:LightGrey; color:black"|Batch size
|style="background:LightGrey; color:black"|Batch size
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|style="background:WhiteSmoke; color:black"|
*1-25 4" wafer per run
*1-15 4" wafers per run
*Deposition on both sides of the substrate
*Deposition on both sides of the substrate
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