Specific Process Knowledge/Etch/DRIE-Pegasus: Difference between revisions
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# The backsides of the wafers must be absolutely clean: Wipe with IPA or blow dry the backside of every wafer. | # The backsides of the wafers must be absolutely clean: Wipe with IPA or blow dry the backside of every wafer. | ||
# Loading bonded wafers (''only'' bonded wafers and 6" wafers) using the load lock must be done with utmost care avoiding to change the position of the carousel. | # Loading bonded wafers (''only'' bonded wafers and 6" wafers) using the load lock must be done with utmost care avoiding to change the position of the carousel. | ||
# | # Processing using the MACS may be done either manually or automatically. | ||
Please contact Roy, Peter or Jonas to make a training session. | Please contact Roy, Peter or Jonas to make a training session. | ||
</div> | </div> | ||