Specific Process Knowledge/Etch/DRIE-Pegasus: Difference between revisions
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# All wafers must be processed using the MACS cassette loader | # All wafers must be processed using the MACS cassette loader. The ''only'' exceptions are bonded wafers and 150 mm wafers - see point 3. Batch recipes must be prepaired - even for single wafer trial runs. | ||
# The backsides of the wafers must be absolutely clean: Wipe with IPA or blow dry the backside of every wafer. | # The backsides of the wafers must be absolutely clean: Wipe with IPA or blow dry the backside of every wafer. | ||
# Loading bonded wafers using the load must be done with utmost care avoiding to change the position of the carousel. | # Loading bonded wafers (''only'' bonded wafers and 6" wafers) using the load lock must be done with utmost care avoiding to change the position of the carousel. | ||
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Please contact Roy, Peter or Jonas to make a training session. | Please contact Roy, Peter or Jonas to make a training session. | ||