Specific Process Knowledge/Etch/DRIE-Pegasus: Difference between revisions
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# The backsides of the wafers must be absolutely clean: Wipe with IPA or blow dry the backside of every wafer. | # The backsides of the wafers must be absolutely clean: Wipe with IPA or blow dry the backside of every wafer. | ||
# Loading bonded wafers using the load must be done with utmost care avoiding to change the position of the carousel. | # Loading bonded wafers using the load must be done with utmost care avoiding to change the position of the carousel. | ||
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Please contact Roy, Peter or Jonas to make a training session. | |||
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