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Specific Process Knowledge/Lithography/Aligners/MAvsMLA: Difference between revisions

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DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers, NLAB-Nlab307-labadviser-users-34891
3,794 edits
Taran (talk | contribs)
DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers, NLAB-Nlab307-labadviser-users-34891
3,794 edits
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| Soft contact, 0.15bar WEC pressure. <br/>Resolution: 1.17µm average; 0.2µm standard deviation. <br/>Yield at 1.25µm: 89% || Soft contact, 0.40bar WEC pressure. <br/>Resolution: 3.77µm average; 0.7µm standard deviation. <br/>Yield at 2.5µm: 4%  
| Soft contact, 0.15bar WEC pressure. <br/>Resolution: 3.92µm average; 0.9µm standard deviation. <br/>Yield at 2.5µm: 8% || Soft contact, 0.40bar WEC pressure. <br/>Resolution: 2.19µm average; 0.5µm standard deviation. <br/>Yield at 2.5µm: 86%  


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| 10µm proximity, 0.15bar WEC pressure. <br/>Resolution: 1.17µm average; 0.2µm standard deviation. <br/>Yield at 1.25µm: 89% || 10µm proximity, 0.15bar WEC pressure.. <br/>Resolution: 3.77µm average; 0.7µm standard deviation. <br/>Yield at 2.5µm: 4%  
| 10µm proximity, 0.15bar WEC pressure. <br/>Resolution: 3.22µm average; 0.8µm standard deviation. <br/>Yield at 2.5µm: 34% || 10µm proximity, 0.40bar WEC pressure. <br/>Resolution: 2.83µm average; 0.6µm standard deviation. <br/>Yield at 2.5µm: 66%  
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