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Specific Process Knowledge/Lithography/Development/manualTMAH developer: Difference between revisions

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'''Tool description'''<br>
'''Tool description'''<br>
Developer: TMAH Manual 02 is a manually operated puddle developer for single wafers or chips. The wafers or chips are loaded manually one by one into the developer, but the developer dispense, puddle time, water rinse, and drying is performed automatically.  
The Developer: TMAH manual 02 is a semi-automatic and programmable single substrate developer system, which can be used for development of resists on chips, 50 mm, 100 mm and 150 mm substrates. The development is done using AZ 726 MIF, which is a 2.38% TMAH solution with wetting agent.


The development is done with the TMAH based AZ 726 MIF developer (2.38 % TMAH in water, with a small amount of wetting agent).
{| class="wikitable"
! style="text-align:left" | Product:
| style="padding-left: 10px" | Laurell EDC-650-HZB-23NP
|-
! style="text-align:left" | Year of purchase:   
| style="padding-left: 10px" | 2016
|-
! style="text-align:left" | Tool modification:
| style="padding-left: 10px" | Modified from e-beam solvent developer to UV TMAH developer in 2024
|-
! style="text-align:left" | Location:
| style="padding-left: 10px" | Cleanroom E-4
|}


'''Documentation and training'''<br>
'''Documentation and training'''<br>