Specific Process Knowledge/Lithography/Development/manualTMAH developer: Difference between revisions
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Tests were performed on under-exposed resist, specifically for showing the difference between the agitation and non-agitation puddle development - the measured results cannot necessarily be transferred directly to a working process, only the vague general behavior of the two process setups; faster/slower development speed and better/worse uniformity across substrate. | Tests were performed on under-exposed resist, specifically for showing the difference between the agitation and non-agitation puddle development - the measured results cannot necessarily be transferred directly to a working process, only the vague general behavior of the two process setups; faster/slower development speed and better/worse uniformity across substrate. | ||
[[file:ManualTMAHdeveloper developRate v1.png|400px|thumb|Development rate for under-exposed resist test]] | |||
[[file:ManualTMAHdeveloper uniformity v1.png|400px|thumb|Non-uniformity for under-exposed resist test]] | |||
{| class="wikitable" | {| class="wikitable" | ||
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| colspan="2"|AZ 726 MIF (2.38% TMAH) | | colspan="2"|AZ 726 MIF (2.38% TMAH) | ||
|} | |} | ||
=Equipment performance and process related parameters= | =Equipment performance and process related parameters= | ||