Specific Process Knowledge/Lithography/Development/manualTMAH developer: Difference between revisions
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==Agitation== | ==Agitation== | ||
Testing showed that adding agitation to the puddle step gave better uniformity in the development rate over the entire area of the substrate as well as increased development rate. Tests were performed on under-exposed resist, specifically for showing the difference between the agitation and non-agitation puddle development. | Testing showed that adding agitation to the puddle step gave better uniformity in the development rate over the entire area of the substrate as well as increased development rate. Tests were performed on under-exposed resist, specifically for showing the difference between the agitation and non-agitation puddle development - the measured results cannot necessarily be transferred directly to a working process, only the vague general behavior of the two process setups; faster/slower development speed and better/worse uniformity across substrate. | ||
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