Specific Process Knowledge/Lithography/Development/DUV developer: Difference between revisions
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=Developer: TMAH Stepper= | |||
[[Image:SUSS_DEV.JPG|400px|right|thumb|The Developer-TMAH-Stepper is placed in F-3.]] | [[Image:SUSS_DEV.JPG|400px|right|thumb|The Developer-TMAH-Stepper is placed in F-3.]] | ||
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=Process information= | |||
[[Image:140 250 nm tilt22 (1).jpg|400px|right|thumb|The SEM picture of 250 nm pillars and lines. Exposure dose is 140 J/m2.]] | [[Image:140 250 nm tilt22 (1).jpg|400px|right|thumb|The SEM picture of 250 nm pillars and lines. Exposure dose is 140 J/m2.]] | ||
The development process will be performed by the customer together with the Photolith group of DTU Nanolab. In case you would like to do DUV lithography please contact Lithography team, who will consult you and run your wafers together with you. | The development process will be performed by the customer together with the Photolith group of DTU Nanolab. In case you would like to do DUV lithography please contact Lithography team, who will consult you and run your wafers together with you. | ||
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Here you can find a [[media:250nm_ines_and_pillars_after_developing_i_60sec.pdf| chart]] demonstrating a dependence between 250 nm line width/pillars diameter and exposure dose. | Here you can find a [[media:250nm_ines_and_pillars_after_developing_i_60sec.pdf| chart]] demonstrating a dependence between 250 nm line width/pillars diameter and exposure dose. | ||
=Standard processes= | |||
Post-exposure bake sequences: | Post-exposure bake sequences: | ||
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=Equipment performance and process related parameters= | |||
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