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Specific Process Knowledge/Lithography/Development/manualTMAH developer: Difference between revisions

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==Developer: TMAH Manual 02==
=Developer: TMAH Manual 02=
[[file:Developer_TMAH_manual_02.jpg|400px|right|thumb|Developer: TMAH Manual 02 is located in E-4.]]
[[file:Developer_TMAH_manual_02.jpg|400px|right|thumb|Developer: TMAH Manual 02 is located in E-4.]]


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The user manual, user APV, and contact information can be found in [http://labmanager.dtu.dk/function.php?module=Machine&view=view&mach=324 LabManager] - '''requires login'''
The user manual, user APV, and contact information can be found in [http://labmanager.dtu.dk/function.php?module=Machine&view=view&mach=324 LabManager] - '''requires login'''


===Process information===
=Process information=
All recipes use the following structure:
All recipes use the following structure:
#Pressurize the TMAH canister
#Pressurize the TMAH canister
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*5x060s
*5x060s


=== Equipment performance and process related parameters ===
=Equipment performance and process related parameters=


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{| class="wikitable"

Revision as of 12:02, 12 January 2026

Developer: TMAH Manual 02

Developer: TMAH Manual 02 is located in E-4.

Developer: TMAH Manual 02 is a manually operated puddle developer for single wafers or chips. The wafers or chips are loaded manually one by one into the developer, but the developer dispense, puddle time, water rinse, and drying is performed automatically.

The development uses the TMAH based AZ 726 MIF developer (2.38 % TMAH in water with a small amount of wetting agent).

Training video

The user manual, user APV, and contact information can be found in LabManager - requires login

Process information

All recipes use the following structure:

  1. Pressurize the TMAH canister
  2. Dispense puddle while rotating substrate slowly
  3. Puddle development with agitation of substrate
  4. Spin off developer
  5. Clean substrate and chamber with DI water
  6. Dry substrate and chamber with nitrogen

Multipuddle recipes repeat steps 2-4 for the given number of puddles.


Process recipes
(Updated 2026-01-12, JEHEM)

  • -Rinse-
  • 1x015s
  • 1x030s
  • 1x060s
  • 1x120s
  • 2x060s
  • 5x060s

Equipment performance and process related parameters

Tool purpose

Development of UV resists:

  • AZ nLOF 2020
  • AZ MIR 701
  • AZ 5214E
  • AZ 4562

Development of DUV resists:

  • KrF M230Y
  • KrF M35G
Developer

AZ 726 MIF
(2.38% TMAH)

Development method Puddle
Handling method
  • Non-vacuum chuck for 100 mm & 150 mm wafers
  • Non-vacuum chuck for chips and 50 mm wafers
Process temperature Room temperature
Process agitaion 15 cycles per minute
Process rinse DI water
Substrate sizes
  • Chips
  • 50 mm wafers
  • 100 mm wafers
  • 150 mm wafers
Substrate materials
  • All cleanroom allowed materials
  • Film, or pattern, of all materials except Type IV
Substrate batch size 1


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