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Specific Process Knowledge/Lithography/Development: Difference between revisions

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DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers, danchip
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Jehem (talk | contribs)
DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers, danchip
1,871 edits
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[[Image:IMG 2464.JPG|400px|right|thumb|Developer: TMAH Manual 02 is located in E-4.]]
[[Image:IMG 2464.JPG|400px|right|thumb|Developer: TMAH Manual 02 is located in E-4.]]


Developer: TMAH Manual 02 is a manually operated single wafer, or chip, puddle developer. It uses the TMAH based AZ 726 MIF developer (2.38 % TMAH in  water with a small amount of wetting agent). The wafers or chips are loaded manually one by one into the developer. Developer dispense, puddle time, water rinse, and drying is performed automatically by the equipment.
Developer: TMAH Manual 02 is a manually operated puddle developer for single wafers or chips. The wafers or chips are loaded manually one by one into the developer, but the developer dispense, puddle time, water rinse, and drying is performed automatically.  
 
The development uses the TMAH based AZ 726 MIF developer (2.38 % TMAH in  water with a small amount of wetting agent).


'''[https://www.youtube.com/watch?v=btinNzYnLnY Training video]'''
'''[https://www.youtube.com/watch?v=btinNzYnLnY Training video]'''
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#Pressurize the TMAH canister
#Pressurize the TMAH canister
#Dispense puddle while rotating substrate slowly
#Dispense puddle while rotating substrate slowly
#Puddle development while not rotating
#Puddle development with agitation of substrate
#Agitate substrates with 15 cycles per minute
#Spin off developer
#Spin off developer
#Clean substrate and chamber with DI water
#Clean substrate and chamber with DI water
#Dry substrate and chamber with nitrogen
#Dry substrate and chamber with nitrogen


Multi-puddle recipes repeat steps 2-5 for the given number of puddles.
Multipuddle recipes repeat steps 2-4 for the given number of puddles.




'''Process recipes'''<br>
'''Process recipes'''<br>
(Updated 2026-01-12, JEHEM)
*-Rinse-
*-Rinse-
*1x015s
*1x015s
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=== Equipment performance and process related parameters ===
=== Equipment performance and process related parameters ===


{|border="1" cellspacing="1" cellpadding="10" style="text-align:left;"
{| class="wikitable"
 
|-
 
! scope=row style="text-align: left;" | Tool purpose
!style="background:silver; color:black;" align="center" width="60"|Purpose
|
|style="background:LightGrey; color:black"|
|style="background:WhiteSmoke; color:black"|
Development of UV resists:
Development of UV resists:
*AZ nLOF
*AZ nLOF 2020
*AZ MiR 701
*AZ MIR 701
*AZ 5214E
*AZ 5214E
*AZ 4562
*AZ 4562
Development of DUV resists:
Development of DUV resists:
*KRF M230Y
*KrF M230Y
*KRF M35G
*KrF M35G
|-
|-
!style="background:silver; color:black;" align="center" width="60"|Developer  
! scope=row style="text-align: left;" | Developer
|style="background:LightGrey; color:black"|
|  
|style="background:WhiteSmoke; color:black"|
AZ 726 MIF <br>
AZ 726 MIF<br>
(2.38% TMAH)
(2.38% TMAH in water)
|-
|-
!style="background:silver; color:black" align="center" valign="center" rowspan="2"|Method
! scope=row style="text-align: left;" | Development method
|style="background:LightGrey; color:black"|Development
| Puddle
|style="background:WhiteSmoke; color:black"|
Puddle
|-
|-
|style="background:LightGrey; color:black"|Handling
! scope=row style="text-align: left;" | Handling method
|style="background:WhiteSmoke; color:black"|
|
*Chip chuck for chips and 50 mm wafers
*Non-vacuum chuck for 100 mm & 150 mm wafers
*Non-vacuum chuck for 100 mm and 150 mm wafers
*Non-vacuum chuck for chips and 50 mm wafers
|-
|-
!style="background:silver; color:black" align="center" valign="center" rowspan="3"|Process parameters
! scope=row style="text-align: left;" | Process temperature
|style="background:LightGrey; color:black"|Temperature
| Room temperature
|style="background:WhiteSmoke; color:black"|
Room temperature
|-
|-
|style="background:LightGrey; color:black"|Agitation
! scope=row style="text-align: left;" | Process agitaion
|style="background:WhiteSmoke; color:black"|
| 15 cycles per minute
15 cycles per minute
|-
|-
|style="background:LightGrey; color:black"|Rinse
! scope=row style="text-align: left;" | Process rinse
|style="background:WhiteSmoke; color:black"|
| DI water
DI water
|-
|-
!style="background:silver; color:black" align="center" valign="center" rowspan="3"|Substrates
! scope=row style="text-align: left;" | Substrate sizes
|style="background:LightGrey; color:black"|Substrate size
|  
|style="background:WhiteSmoke; color:black"|
*Chips
*Chips (6-60 mm)
*50 mm wafers
*100 mm wafers
*100 mm wafers
*150 mm wafers
*150 mm wafers
|-
|-
| style="background:LightGrey; color:black"|Allowed materials
! scope=row style="text-align: left;" | Substrate materials
|style="background:WhiteSmoke; color:black"|
|
*All cleanroom approved materials  
*All cleanroom allowed materials
*Film, or pattern, of all materials except Type IV
*Film, or pattern, of all materials except Type IV
|-
|-
|style="background:LightGrey; color:black"|Batch size
! scope=row style="text-align: left;" | Substrate batch size
|style="background:WhiteSmoke; color:black"|
| 1
1
|-
|}
|}
<br clear="all" />
<br clear="all" />
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