Specific Process Knowledge/Lithography/Aligners/Aligner: Maskless 01 processing: Difference between revisions
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<span style="color:red">If 3+ marks are used, but scaling and shearing is not applied, ''significant'' misalignment will be observed, even on chips. On a 4" wafer the shift in Y can be several hundred µm.</span> | <span style="color:red">If 3+ marks are used, but scaling and shearing is not applied, ''significant'' misalignment will be observed, even on chips. On a 4" wafer the shift in Y can be several hundred µm.</span> | ||
Using only two alignment marks (on the X-axis) is recommended when aligning to patterns exposed | Using only two alignment marks (on the X-axis) is recommended when aligning to patterns exposed on Aligner: Maskless 01. When aligning to patterns exposed on a different machine, using 4 alignment marks and all corrections applied yields the best alignment accuracy. The remaining error when using 4 alignment marks can be compensated by manipulating the design file. Please see the section below for details. <br/> | ||
==Alignment tests== | ==Alignment tests== | ||