Specific Process Knowledge/Lithography/Baking: Difference between revisions
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(All substrates and film or pattern of all types, unless otherwise noted on the hotplate) | (All substrates and film or pattern of all types, unless otherwise noted on the hotplate) | ||
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Silicon and glass substrates | Tool dependent. Typically Silicon, III-V, and glass substrates. | ||
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Silicon, glass, and high Tg polymer substrates | Silicon, glass, and high Tg polymer substrates | ||
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Silicon, glass, and high Tg polymer substrates | Silicon, glass, and high Tg polymer substrates | ||
Film or pattern of all types except resist | Film or pattern of all types except resist | ||
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Hotplate dependent. Any restrictions will be noted on the hotplate. | Hotplate dependent. Any restrictions will be noted on the hotplate. | ||
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Low Tg polymer, copper, steel substrates. | |||
Pb, Te films. | |||
|III-V, low Tg polymer, copper, steel substrates | |III-V, low Tg polymer, copper, steel substrates | ||
|III-V, low Tg polymer, copper, steel substrates | |III-V, low Tg polymer, copper, steel substrates | ||