Specific Process Knowledge/Thin film deposition/Temescal: Difference between revisions

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 == Process information ==
-*[[/Acceptance Test|Acceptance Test]]. Describes '''thickness uniformity''' tests, '''side wall deposition''' tests, '''sheet resistance''' tests and tests of the '''ion source''' for substrate cleaning.
+[[/Acceptance Test|Acceptance Test information is found here]]. Describes '''thickness uniformity''' tests, '''side wall deposition''' tests, '''sheet resistance''' tests and tests of the '''ion source''' for substrate cleaning.
 ====Materials for e-beam evaporation in the E-beam evaporator (Temescal)====
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 [[Specific Process Knowledge/Thin film deposition/Deposition of Silver|Silver (Ag)]]<br>
 [[Specific Process Knowledge/Thin film deposition/Deposition of Tantalum|Tantalum (Ta)]]<br>
-[[Specific Process Knowledge/Thin film deposition/Deposition of Tin|Tin (Sn)]]<br>
+[[Specific Process Knowledge/Thin film deposition/Deposition of Tin|Tin (Sn)]] (we recommend using sputtering instead)<br>
 [[Specific Process Knowledge/Thin film deposition/Deposition of Titanium|Titanium (Ti)]]<br>
 [[Specific Process Knowledge/Thin film deposition/Deposition of Tungsten|Tungsten (W)]]<br>
-All the above materials can be deposited with the E-beam Evaporator Temescal, although Sn is not recommended - we found sputtering worked better for that.
 If your favorite metal is not on the list you are welcome to ask if we can develop a recipe.