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DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers, NLAB-Nlab347-labadviser-users-35231
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== Process information ==
== Process information ==
*Info about [[Specific Process Knowledge/Characterization/Dektak XTA#Measurement Accuracy |measurement accuracy]] (''measured with Dektak XTA'')
*Info about [[Specific Process Knowledge/Characterization/Dektak XTA#Measurement Accuracy |measurement accuracy]] (''measured with Dektak XTA'')
*Vendor's description of stress measurements including reproducibility and flatness of scans [https://labmanager.dtu.dk/view_binary.php?fileId=6385] (''requires login as it seems not freely available from Vendor's website'')
*Vendor's description of [https://labmanager.dtu.dk/view_binary.php?fileId=6385 instrument specs including reproducibility and flatness of scans] (''requires login as it seems not freely available from vendor's website'')
*Using the analysis software: [[Specific Process Knowledge/Characterization/Tencor P17#Apex Software for Data Analysis|Apex software access & tips]]
*Using the analysis software: [[Specific Process Knowledge/Characterization/Tencor P17#Apex Software for Data Analysis|Apex software access & tips]]
*Tips on making [https://labmanager.dtu.dk/view_binary.php?fileId=5543 2D stress measurements] ''(requires login)''
*Tips on making [https://labmanager.dtu.dk/view_binary.php?fileId=5543 2D stress measurements] ''(requires login)''
Most users will want to make 3D stress measurements, which is described in the regular Nanolab manual for the P17, also found on LabManager. It counts as "3D" if you wish to make 2 perpendicular scans. A "2D" stress scan means a single line scan per wafer - the software does not allow rotation of the stage for this type of scan.
Most users will want to make 3D stress measurements, which is described in the regular Nanolab manual for the P17, also found on LabManager. It counts as "3D" if you wish to make 2 perpendicular scans. A "2D" stress scan means a single line scan per wafer - the software does not allow rotation of the stage for this type of scan.


*Vendor's document on 2D stress measurements (also somewhat informative for 3D stress measurements) including info on repeatability and scan flatness as well as how the fitting to calculate the local radius of the wafer is done: [https://www.kla.com/wp-content/uploads/KLA_AppNote_Stylus_2D_Stress.pdf].  
*Vendor's document on 2D stress measurements (also somewhat informative for 3D stress measurements) including info on the automatic fitting to calculate the local radius of the wafer: [https://www.kla.com/wp-content/uploads/KLA_AppNote_Stylus_2D_Stress.pdf].  
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