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Specific Process Knowledge/Thin film deposition/Deposition of Chromium: Difference between revisions

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!
!
! E-beam evaporation ([[Specific Process Knowledge/Thin film deposition/Temescal|E-beam evaporator (Temescal)]] and [[Specific Process Knowledge/Thin film deposition/10-pocket e-beam evaporator|E-beam evaporator (10-pockets)]])
! E-beam evaporation ([[Specific Process Knowledge/Thin film deposition/Temescal|E-beam evaporator (Temescal)]] and [[Specific Process Knowledge/Thin film deposition/10-pocket e-beam evaporator|E-beam evaporator (10-pockets)]])
! E-beam evaporation and sputter deposition ([[Specific Process Knowledge/Thin film deposition/Wordentec|Wordentec]])
! Thermal evaporation ([[Specific Process Knowledge/Thin film deposition/thermalevaporator|Thermal evaporator]])
! Thermal evaporation ([[Specific Process Knowledge/Thin film deposition/thermalevaporator|Thermal evaporator]])
! Sputter deposition ([[Specific Process Knowledge/Thin film deposition/Lesker|Lesker sputterer]])
! Sputter deposition ([[Specific Process Knowledge/Thin film deposition/Lesker|Lesker sputterer]])
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! General description
! General description
|E-beam deposition of Chromium
|E-beam deposition of Chromium
|E-beam and sputter deposition of Chromium
|Thermal deposition of Chromium
|Thermal deposition of Chromium
|Sputter deposition of Chromium
|Sputter deposition of Chromium
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! Pre-clean
! Pre-clean
|Ar ion gun (only in E-beam evaporator Temescal)
|Ar ion gun (only in E-beam evaporator Temescal)
|RF Ar clean
|
|
|RF Ar clean
|
|RF Ar clean
|RF Ar clean
|-
|-
|-style="background:WhiteSmoke; color:black"
|-style="background:WhiteSmoke; color:black"
! Layer thickness
! Layer thickness
|10Å to 1µm*
|10Å to 300 nm*
|10Å to 1µm*
|100 nm
|80 nm
|at least up to 200 nm
|at least up to 200 nm
|at least up to 200 nm
|at least up to 200 nm
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! Deposition rate
! Deposition rate
|1 Å/s to 10 Å/s
|1 Å/s to 10 Å/s
|1 Å/s to 10 Å/s (e-beam)
Sputtering: Depends on process parameters. See [[Specific Process Knowledge/Thin film deposition/Deposition of Chromium/Sputtering of Cr in Wordentec|here]] and process log.
|1 Å/s
|1 Å/s
|Depends on [[/Sputtering of Cr in Sputter System (Lesker)|process parameters]]. At least up to 1.48 Å/s. See process log.
|Depends on [[/Sputtering of Cr in Sputter System (Lesker)|process parameters]]. At least up to 1.48 Å/s. See process log.
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*3x8" wafers (ask for holder)
*3x8" wafers (ask for holder)
*Many smaller pieces
*Many smaller pieces
|
|
*24x2" wafers or  
Up to *3x 4" wafers or
*6x4" wafers or
*1x6" or 1x 8" wafer
*6x6" wafers
*Many smaller samples
|
*4x 2" wafer or
*1x 4" wafers or
*1x6" wafer or
*Several smaller pieces
*In theory up to 8" wafer (or 2x4" wafer) but uniformity will be bad
|
|
*1x6" wafers
*1x6" wafers
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|  
|  
Almost any that does not degas. See the [http://labmanager.dtu.dk/function.php?module=XcMachineaction&view=edit&MachID=511 cross-contamination sheet].
Almost any that does not degas. See the [http://labmanager.dtu.dk/function.php?module=XcMachineaction&view=edit&MachID=511 cross-contamination sheet].
|
Almost any that does not degas. See the [http://labmanager.dtu.dk/function.php?module=XcMachineaction&view=edit&MachID=167 cross-contamination sheet].
|
|
Almost any that does not degas. See the [http://labmanager.dtu.dk/function.php?module=XcMachineaction&view=edit&MachID=404 cross-contamination sheet].
Almost any that does not degas. See the [http://labmanager.dtu.dk/function.php?module=XcMachineaction&view=edit&MachID=404 cross-contamination sheet].
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! Comment
! Comment
| Takes approx. 20 min to pump down
| Takes approx. 20 min to pump down
| Takes approx. 1 hour to pump down
| Takes approx. 20 min to pump down
| Takes approx. 20 min to pump down
|
|
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