Jump to content

Specific Process Knowledge/Characterization: Difference between revisions

From LabAdviser
← Older editNewer edit →
VisualWikitext
Mmat (talk | contribs)
NLAB-Employees-701, NLAB-LabmanagerAllUsers, Administrators
1,954 edits
Mmat (talk | contribs)
NLAB-Employees-701, NLAB-LabmanagerAllUsers, Administrators
1,954 edits
Line 59: Line 59:
|-
|-
|-style="background:#C0C0C0;" align="center"
|-style="background:#C0C0C0;" align="center"
|align="left"| [[Specific_Process_Knowledge/Characterization/Element_analysis|Element analysis]]||||x||||||||||||||x||x  4)||||||x  4)||||||||||||||
|align="left"| [[Specific_Process_Knowledge/Characterization/Element_analysis|Element analysis]]||||x||||||||||||||x||x  <sup>{{fn|4}}</sup>||||||x  <sup>{{fn|4}}</sup>||||||||||||||
|-
|-
|-style="background:#DCDCDC;" align="center"
|-style="background:#DCDCDC;" align="center"
|align="left"| [[Specific_Process_Knowledge/Characterization/Stress_measurement|Film stress]]||||||||x||||||||||||||||||x  7)||||||||||||||
|align="left"| [[Specific_Process_Knowledge/Characterization/Stress_measurement|Film stress]]||||||||x||||||||||||||||||x  <sup>{{fn|7}}</sup>||||||||||||||
|-
|-
|-style="background:#C0C0C0;" align="center"
|-style="background:#C0C0C0;" align="center"
Line 80: Line 80:
|-
|-
|-style="background:#DCDCDC;" align="center"
|-style="background:#DCDCDC;" align="center"
|align="left"| Reflectivity||||||||||||x||x||||||x 6)||||||||||||||||||||x
|align="left"| Reflectivity||||||||||||x||x||||||x <sup>{{fn|6}}</sup>||||||||||||||||||||x
|-
|-
|-style="background:#C0C0C0;" align="center"
|-style="background:#C0C0C0;" align="center"
Line 89: Line 89:
|-
|-
|-style="background:#C0C0C0;" align="center"
|-style="background:#C0C0C0;" align="center"
|align="left"| Step coverage||x  1)||x  1)||||||||||||||||||||||||||||||||||||
|align="left"| Step coverage||x  <sup>{{fn|1}}</sup>||x  <sup>{{fn|1}}</sup>||||||||||||||||||||||||||||||||||||
|-
|-
|-style="background:#DCDCDC;" align="center"
|-style="background:#DCDCDC;" align="center"
Line 98: Line 98:
|-
|-
|-style="background:#DCDCDC;" align="center"
|-style="background:#DCDCDC;" align="center"
|align="left"| [[Specific_Process_Knowledge/Characterization/Measurement_of_film_thickness_and_optical_constants|Thin film thickness]]||x  1)||x  1)||x  2)||x  2)||x  ||x||x||||||x 5)||x  3)||||x||||||||||||||
|align="left"| [[Specific_Process_Knowledge/Characterization/Measurement_of_film_thickness_and_optical_constants|Thin film thickness]]||x  <sup>{{fn|1}}</sup>||x  <sup>{{fn|1}}</sup>||x  <sup>{{fn|2}}</sup>||x  <sup>{{fn|2}}</sup>||x  ||x||x||||||x <sup>{{fn|5}}</sup>||x  <sup>{{fn|3}}</sup>||||x||||||||||||||
|-
|-
|-style="background:#C0C0C0;" align="center"
|-style="background:#C0C0C0;" align="center"
Line 104: Line 104:
|-
|-
|-style="background:#DCDCDC;" align="center"
|-style="background:#DCDCDC;" align="center"
|align="left"| [[Specific_Process_Knowledge/Characterization/Thickness_Measurer|Wafer thickness]]||x  1)||x  1)||||||||||||x||||||||||||||||||||||||
|align="left"| [[Specific_Process_Knowledge/Characterization/Thickness_Measurer|Wafer thickness]]||x  <sup>{{fn|1}}</sup>||x  <sup>{{fn|1}}</sup>||||||||||||x||||||||||||||||||||||||
|-
|-
|-style="background:#C0C0C0;" align="center"
|-style="background:#C0C0C0;" align="center"
Line 110: Line 110:
|-  
|-  
|}
|}
 
<br clear="all">
 
<br>
 
<sup>{{fn|1}}</sup> Using the cross section method
 
<sup>{{fn|2}}</sup> Using the create step method
# Using the cross section method
<sup>{{fn|3}}</sup> With known resistivity
# Using the create step method
<sup>{{fn|4}}</sup> Composition information for crystalline materials
# With known resistivity
<sup>{{fn|5}}</sup> Only single layer
# Composition information for crystalline materials
<sup>{{fn|6}}</sup> Good for characterization of VCSEL structures and DBR mirrors
# Only single layer
<sup>{{fn|7}}</sup> Only for crystalline films
# Good for characterization of VCSEL structures and DBR mirrors
# Only for crystalline films


== Choose characterization topic ==
== Choose characterization topic ==

Revision as of 11:13, 28 May 2025

The content on this page, including all images and pictures, was created by DTU Nanolab staff, unless otherwise stated.

Feedback to this page: click here

Overview of characteristics and where to measure it

Optical Microscopes SEM (incl. EDX) AFM Stylus profilers Optical profilers Filmtek (reflectometer) Ellipsometer Thickness stylus XPS PL mapper 4-point probe Probe station XRD Life time scanner Drop shape analyser Hardness tester Particle scanner IR-camera III-V ECV-profiler Microspectrophotometer (Craic 20/30 PV)
Breakdown voltage
Carrier density/doping profile x
Charge carrier life time x
Contact angle hydrophobic/hydrophillic x
Crystallinity x
Deposition uniformity x x x
Dimensions(in plane) x x (x) (x) x x
Dimensions(height)/Topography (x) (x) x x x
Electrical conductivity x
Element analysis x x x 4 x 4
Film stress x x 7
Imaging x x x x x
Material Hardness x
Band gap x x x
Particles x x x x x
Phase changes
Reflectivity x x x 6 x
Refractive index x x
Resistivity x
Step coverage x 1 x 1
Surface roughness x x x x
Thermal conductivity
Thin film thickness x 1 x 1 x 2 x 2 x x x x 5 x 3 x
Voids in wafer bonding x x x
Wafer thickness x 1 x 1 x
Work function x



1 Using the cross section method 2 Using the create step method 3 With known resistivity 4 Composition information for crystalline materials 5 Only single layer 6 Good for characterization of VCSEL structures and DBR mirrors 7 Only for crystalline films

Choose characterization topic

Choose equipment

AFM

Electrical measurements

Element analysis

Optical and stylus profilers

Optical microscopes

Optical characterization

SEMs at DTU Nanolab - building 307/314

SEM's in building 346

TEMs at DTU Nanolab - building 307/314

XRD

Various

Decommissioned equipment

Retrieved from "https://labadviser.nanolab.dtu.dk//index.php?title=Specific_Process_Knowledge/Characterization&oldid=52796"