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Specific Process Knowledge/Thin film deposition: Difference between revisions

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*[[/Cluster-based multi-chamber high vacuum sputtering deposition system|Sputter-system Metal-Oxide (PC1) and Sputter-system Metal-Nitride (PC3) ]] - ''Cluster-based multi-chamber high vacuum sputtering deposition system''  
*[[/Cluster-based multi-chamber high vacuum sputtering deposition system|Sputter-system Metal-Oxide (PC1) and Sputter-system Metal-Nitride (PC3) ]] - ''Cluster-based multi-chamber high vacuum sputtering deposition system''  
*[[/Lesker|Lesker]] - ''Sputter tool''
*[[/Lesker|Lesker]] - ''Sputter tool''
*[[/Wordentec|Wordentec]] - ''E-beam evaporator, sputter and thermal evaporator''
*[[/thermalevaporator|Thermal evaporator]]  
*[[/thermalevaporator|Thermal evaporator]]  
*[[/Temescal|E-Beam Evaporator (Temescal)]]
*[[/Temescal|E-Beam Evaporator (Temescal)]]
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