Specific Process Knowledge/Lithography/Development: Difference between revisions
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*100 mm carrier for up to 6 wafers | *100 mm carrier for up to 6 wafers | ||
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*Vacuum | *Vacuum-free edge-grip chucks for 50 mm, 100 mm, 150 mm, and 200 mm substrates | ||
*Chip chuck for chips & 2" substrates | *Chip chuck for chips & 2" substrates | ||
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*Vacuum chuck for 100 mm & 150 mm substrates | *Vacuum-free edge-grip chuck for 100 mm & 150 mm substrates | ||
*Chip chuck for chips & 2" substrates | *Chip chuck for chips & 2" substrates | ||
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==Manual beaker development in fumehood== | ==Manual beaker development in fumehood== | ||
Beaker development is a fall-back option if you have a process, which is not compatible with the automatic, or semi-automatic, tools. We always recommend using, or at least trying, the automatic and semi-automatic tools, instead of using manual beaker development. | Beaker development is a fall-back option if you have a process, which is not compatible with the automatic, or semi-automatic, tools. We always recommend using, or at least trying, the automatic and semi-automatic tools, instead of using manual beaker development. | ||