Specific Process Knowledge/Lithography/Descum: Difference between revisions
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==Descum processing in plasma asher 4 & 5== | ==Descum processing in plasma asher 4 & 5== | ||
Descum of AZ 5214E on 100 mm wafers. The descum process was tested for single substrates, as well as 3 substrates, placed vertically in the glass boat. For the 3 substrates only the center substrate was used for testing, the front and back wafers were used as dummy wafers.<br> | Descum of AZ 5214E on 100 mm wafers. The descum process was tested for single substrates, as well as 3 substrates, placed vertically in the glass boat. For the 3 substrates only the center substrate was used for testing, the front and back wafers were used as dummy wafers.<br> | ||
When running multiple wafers, the first and last wafers should always be dummy wafers. | When running multiple wafers, the first and last wafers should always be dummy wafers. | ||
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<hr> | <hr> | ||
'''Comparison between single substrate processing and multi substrate processing'''<br> | |||
Processing a single substrate using the standard descum settings will provide users with a relatively controllable and uniform process. Adding dummy substrates in close proximity with the process substrate will reduce the ashing rate and improve the uniformity: | |||
<gallery mode="packed-hover" heights="150"> | |||
PA_descum_compareAmount_v1.png|Ashing amount | |||
PA_descum_compareRate_v1.png|Ashing rate | |||
PA_descum_compareUniformity_v1.png|Non-uniformity | |||
</gallery> | |||
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=Plasma Asher 5= | =Plasma Asher 5= | ||
<span style="color:red">Coming soon</span> | <span style="color:red">Coming soon</span> | ||