Specific Process Knowledge/Lithography/UVExposure: Difference between revisions

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 |style="background:WhiteSmoke; color:black" colspan="2"|
 All cleanroom materials
+|-
+|style="background:LightGrey; color:black"|Batch
+|style="background:WhiteSmoke; color:black" colspan="2"|
+|-
+|}
+<br clear="all" />
+== Aligner: Maskless 04 ==
+[[Image:Heidelberg_uMLA.JPG|300x300px|thumb|Aligner: Maskless 04 is installed in PolyFabLab in building 347.]]
+The logon password for the PC is "mla" (without quotation marks).
+The µMLA Tabletop Maskless Aligner from Heidelberg, located in PolyFabLab in building 347, is a direct exposure lithography tool installed in 2024.
+It is a UV exposure system, that exposes the patterns directly on photosensitive resists on chips, 2, 4, and 6 inch substrates, without prior fabrication of a mask.
+The system offers top side alignment with good accuracy.
+Link to information about [[Specific_Process_Knowledge/Pattern_Design#Alignment_marks|alignment mark design]].
+The user manual and contact information can be found in LabManager:
+Equipment info in [http://labmanager.dtu.dk/function.php?module=Machine&view=view&mach=544 LabManager] - '''requires login'''
+===Exposure dose and defocus===
+[[Specific Process Knowledge/Lithography/Resist#Aligner:_Maskless_04|Information on UV exposure dose]]
+===[[Specific Process Knowledge/Lithography/Aligners/Aligner: Maskless 04 processing|Process information]]===
+*[[Specific_Process_Knowledge/Lithography/Aligners/Aligner:_Maskless_04_processing#Exposure_technology|Exposure technology]]
+*[[Specific_Process_Knowledge/Lithography/Aligners/Aligner:_Maskless_04_processing#Process_Parameters|Process parameters]]
+*[[Specific_Process_Knowledge/Lithography/Aligners/Aligner:_Maskless_04_processing#Substrate_positioning|Substrate positioning]]
+*[[Specific_Process_Knowledge/Lithography/Aligners/Aligner:_Maskless_04_processing#Alignment|Alignment]]
+=== Equipment performance and process related parameters ===
+{|border="1" cellspacing="1" cellpadding="10" style="text-align:left;"
+!style="background:silver; color:black;" align="center" width="60"|Purpose
+|style="background:LightGrey; color:black"|
+|style="background:WhiteSmoke; color:black" colspan="2"|
+Alignment and UV exposure
+|-
+!style="background:silver; color:black" align="left" valign="center" rowspan="6"|Performance
+|style="background:LightGrey; color:black"|Exposure mode
+|style="background:WhiteSmoke; color:black" colspan="2"|
+Projection or direct writing
+|-
+| style="background:LightGrey; color:black"|Exposure light
+|style="background:WhiteSmoke; color:black" colspan="2"|
+nm (LED) or 405nm (diode laser)
+|-
+|style="background:LightGrey; color:black"|Focusing method
+|style="background:WhiteSmoke; color:black" colspan="2"|
+Pneumatic or Optical
+|-
+|style="background:LightGrey; color:black"|Minimum structure size
+|style="background:WhiteSmoke; color:black" colspan="2"|
+down to 1µm
+|-
+|style="background:LightGrey; color:black"|Design formats
+|style="background:WhiteSmoke; color:black" colspan="2"|
+*GDS-II
+*CIF
+*DXF
+*Gerber
+*HIMT format
+|-
+|style="background:LightGrey; color:black"|Alignment modes
+|style="background:WhiteSmoke; color:black" colspan="2"|
+Top side only
+|-
+!style="background:silver; color:black" align="center" valign="center" rowspan="3"|Substrates
+|style="background:LightGrey; color:black"|Substrate size
+|style="background:WhiteSmoke; color:black" colspan="2"|
+* maximum writing area: 150x150 mm<sup>2</sup>
+* 150 mm wafer
+* 100 mm wafer
+* 50 mm wafer
+* pieces down to 3x3 mm<sup>2</sup> with optical autofocus
+|-
+| style="background:LightGrey; color:black"|Allowed materials
+|style="background:WhiteSmoke; color:black" colspan="2"|
+All PolyFabLab materials
 |-
 |style="background:LightGrey; color:black"|Batch