Specific Process Knowledge/Lithography

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There are four different types of lithography available at DTU Nanolab:

• UV Lithography
• DUV Stepper Lithography
• E-beam Lithography
• Nano Imprint Lithography

Comparing lithography methods at DTU Nanolab

	UV Lithography	DUV Stepper Lithography	E-beam Lithography	Nano Imprint Lithography
Generel description	Pattern transfer via ultraviolet (UV) light	Pattern transfer via deep ultraviolet (DUV) light	Patterning by electron beam	Pattern transfer via hot embossing (HE)
Pattern size range	~0.6 µm and up (resist type, thickness, and pattern dependent)	~200 nm and up (pattern type, shape and pitch dependent)	~12 nm - 1 µm (and larger at high currents)	~20 nm and up
Resist type	UV sensitive: AZ 5214E, AZ 4562, AZ MiR 701 (positive) AZ 5214E, AZ nLOF 2020, SU-8 (negative)	DUV sensitive JSR KRF M230Y, JSR KRF M35G (positive) UVN2300-0.8 (negative)	E-beam sensitive AR-P6200 CSAR, ZEP502A , PMMA (positive) HSQ, mr-EBL, AR-N 7520 (negative)	Imprint polymers: Topas PMMA mr-I 7030R
Resist thickness range	~0.5 µm to 200 µm	~50 nm to 2 µm	~30 nm to 1 µm	~ 100 nm to 2 µm
Typical exposure time	10 s - 3 min pr. wafer using mask aligners 10 min - 5 hours pr. wafer using maskless aligners	Process dependent: Pattern Pattern area Dose Throughput is up to 60 wafers/hour	Process dependent: Dose, Q [µC/cm2] Beam current, I [A] Pattern area, a [cm2] time [s] = Q*a/I	Process dependent, including heating/cooling rates
Substrate size	chips down to 3 mm x 3 mm 50 mm wafers 100 mm wafers 150 mm wafers 200 mm wafers	100 mm wafers 150 mm wafers 200 mm wafers	We have cassettes fitting: 4 small samples (slit openings: 20mm, 12mm, 8mm, 4mm) 6 wafers of 50 mm in size 3 wafers of 100 mm in size 1 wafer of 150 mm in size 1 wafer of 200 mm in size Only one cassette can be loaded at a time	small samples 50 mm wafers 100 mm wafers 150 mm wafers
Allowed materials	Any standard cleanroom material	Any standard cleanroom material	Any standard cleanroom material, except: Materials that will degas Graphene requires special treatment	Any standard cleanroom material

Equipment Pages

Resist User bottles in the cleanroom UV Resist DUV Resist E-beam Resist Imprint Resist Pretreatment HMDS BHF Oven 250C Coating Spin Coater: Gamma UV Spin Coater: Süss Stepper Spin Coater: Gamma e-beam & UV Spin Coater: RCD8 Spin Coater: Labspin 02/03 Spray Coater Baking Hotplates Ovens	UV Exposure Tools Aligner: MA6-1 Aligner: MA6-2 Aligner: Maskless 01 Aligner: Maskless 02 Aligner: Maskless 03 Deep-UV Exposure DUV Stepper (Canon FPA-3000EX4) Electron Beam Exposure JEOL 9500 Raith Eline Nano Imprint Lithography Molecular Vapour Deposition Imprinter 01	Development Developer: SU8 (wetbench) Developer: E-beam 02 Developer: TMAH Manual 02 Developer: TMAH UV-lithography Developer: TMAH Stepper Descum Plasma Asher 3: Descum Plasma Asher 4 Plasma Asher 5 BHF Lift-off Lift-off Strip Plasma Asher 3: Descum Plasma Asher 4 Plasma Asher 5 Resist Strip

Lithography Tool Package Training

DTU Nanolab offers a Tool Package Training in Lithography (TPT Lithography). You are required to pass this course, in order to get access to the lithography equipment inside the DTU Nanolabs cleanroom facility. The course includes theory on lithographic processes and training videos for specific equipment. The theory part consists of lecture videos followed by quizzes for each section. Once that part has been completed successfully, you can begin the online training for the lithography equipment you need to use. After completing the online training, you can request hands-on training for the lithography equipment inside the cleanroom via training@nanolab.dtu.dk.

The course is available via DTU Learn. You sign up for the course by enrolling yourself in the course here.

Course Description

1. Online lecture videos
2. Quizzes for each section
3. Equipment-related training videos
4. Hands-on training

Hands on training can be requested via training@nanolab.dtu.dk.

Learning objectives

Learn about the fundamentals of lithography processing in a cleanroom fabrication lab:

• Coating
• Exposure
• Development
• Resist, substrates and pre-treatment
• Post-lithography steps

Knowledge and Information about Lithography

Literature Franssila, 2010, Chapter 9: Optical Lithography Franssila, 2010, Chapter 10: Advanced Lithography Handbook of Microlithography, Micromachining, and Microfabrication, Chapter 2: E-beam Lithography Stefan Landis,Lithography, Chapter 3: E-beam Lithography Application notes from MicroChemicals GmbH, e.g. Lithography Trouble-Shooter Lecture videos Lithography TPT lecture videos: Current version (6 videos, 1:28 hours:minutes in total) on YouTube Old version (7 videos, 2:41 hours in total) on YouTube A full lecture series from a UT Austin course on microfabrication by "litho guru" Chris Mack. Half of the lectures are on (projection) lithography :-)	Training videos Training Video: Automatic Spin Coater Training Video: Manual Spin Coater Labspin Training Video: UV Mask Aligner Part I (Operation) Training Video: UV Mask Aligner Part II (Alignment) Training Video: Maskless aligner Training Video Training Video: Maskless aligner Conversion Training Video: Maskless aligner Series and Navigation Training Video: Maskless aligner Alignment Training Video: Automatic Puddle Developer Training Video: Manual Puddle Developer Playlists on YouTube: Maskless aligner (MLA) training videos Lithography equipment training videos (old)	Manuals NB: Access to manuals require login Automatic Spin Coater: Spin Coater: Gamma UV Manual Spin Coater: Spin Coater: Labspin 02 or Spin Coater: Labspin 03 UV Mask Aligner: Aligner: MA6 - 2 Automatic Puddle Developer: Developer: TMAH UV-lithography Manual Puddle Developer: Developer: TMAH Manual Manual E-beam Developer: Developer: E-beam Manual Process Flows UV resist process flows E-beam resist process flows Old TPT process flow (first print) Old TPT process flow (alignment)