Specific Process Knowledge/Lithography/LiftOff: Difference between revisions

Revision as of 14:45, 30 July 2024 view source Paphol (talk \| contribs) DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers 912 edits →Poor metal (TiAu) adhesion/ Metal delaminating after lift-off ← Older edit		Revision as of 14:46, 30 July 2024 view source Paphol (talk \| contribs) DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers 912 edits →Poor metal (TiAu) adhesion/ Metal delaminating after lift-off Newer edit →
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	'''Problem:''' Mathias experienced the delamination of TiAu after the lift-off process, see the image.		'''Problem:''' Mathias experienced the delamination of TiAu after the lift-off process, see the image.

	'''Solution:''' Adding a descum step (70 ml/min O2, 70 ml/min N2, 150W, 5 min) right before metal depositions.		'''Solution:''' Adding a descum step (70 ml/min O2, 70 ml/min N2, 150W, 5 min) right before metal depositions.