Specific Process Knowledge/Lithography/LiftOff: Difference between revisions
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==Poor metal adhesion/ Metal delaminating after lift-off== | ==Poor metal (TiPt) adhesion/ Metal delaminating after lift-off== | ||
''This experiment was done by Gustav E. Skands(ges@sbtinstruments.com) in May 2024'' | ''This experiment was done by Gustav E. Skands(ges@sbtinstruments.com) in May 2024'' | ||
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Process temperature considerations | Process temperature considerations | ||
The process incorporated a deposition temperature of 50°C, which was maintained without further comparative analysis against room temperature deposition due to the successful outcomes achieved and considerations of operational cost efficiency. | The process incorporated a deposition temperature of 50°C, which was maintained without further comparative analysis against room temperature deposition due to the successful outcomes achieved and considerations of operational cost efficiency. | ||
==Poor metal (TiAu) adhesion/ Metal delaminating after lift-off== | |||
''This experiment was done by Mathias Zambach (zambach@fysik.dtu.dk) in June 2024'' | |||