Specific Process Knowledge/Etch/DRIE-Pegasus/processA: Difference between revisions
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| Line 232: | Line 232: | ||
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|Etch rate in Si | |Etch rate in Si | ||
| | |16 - 18.8 µm/min | ||
|- | |- | ||
|Non-uniformity | |Non-uniformity | ||
| Line 232: | Line 232: | ||
|- | |- | ||
|Etch rate in Si | |Etch rate in Si | ||
| | |16 - 18.8 µm/min | ||
|- | |- | ||
|Non-uniformity | |Non-uniformity | ||